{"id":3895,"date":"2017-11-16T09:37:24","date_gmt":"2017-11-16T08:37:24","guid":{"rendered":"https:\/\/www.ficontec.com\/news\/"},"modified":"2025-11-18T16:46:02","modified_gmt":"2025-11-18T15:46:02","slug":"news","status":"publish","type":"page","link":"https:\/\/www.ficontec.com\/cn\/news\/","title":{"rendered":"News"},"content":{"rendered":"[blank_spacer height=”10px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”3\/4″ el_position=”first last”]\n

The latest news and developments<\/span><\/h1>\n

ficonTEC news, press releases, product developments and corporate updates available here<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”3\/4″ el_position=”first last”]\n

Here we provide a list of the recent press releases, news items and other developments. For more details, simply follow the link, or for more product-related enquiries, simply get in touch via the details in the footer below.<\/p>\n[\/spb_text_block] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

November 2025
\n<\/span><\/p>\n

Product News – <\/span>ficonTEC launches Optical Circuit Switching and the Ai era<\/h3>\n

Optical Circuit Switching (OCS) has emerged as a key technology enabling the next leap in data center performance and efficiency \u2014 particularly as artificial intelligence (AI) and machine learning (ML) workloads drive exponential increases in data movement between compute clusters. Traditional electronic switching architectures are reaching their limits in both latency and energy efficiency… read more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”17563″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ficontec-launches-next-generation-optical-circuit-switching\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

October 2025
\n<\/span><\/p>\n

Product News – <\/span>ficonTEC launches DLT-D1, a multi-site die-level tester for double-sided compact 3D CPO optical engines<\/h3>\n

ficonTEC has announced the launch of the DLT-D1, a next-generation high-throughput, multi-site parallel test handler designed specifically for double-sided compact optical engines. The DLT-D1 extends ficonTEC\u2019s industry-leading Co-Packaged Optics (CPO) test ecosystem, addressing the growing demand for 2.5D and 3D CPO architectures in high-performance computing (HPC) and data switching applications … read more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”17293″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/multi-site-die-level-tester-for-double-sided-compact-3d-cpo-optical-engines\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

September 2025
\n<\/span><\/p>\n

SENKO, BizLink and ficonTEC partner at SEMICON Taiwan 2025 to pioneer advanced optical interconnect manufacturing<\/h3>\n

Taipei, Taiwan, September 2025 \u2013 SENKO Advanced Components, Inc., BizLink Technology, Inc. and ficonTEC Service GmbH announce at SEMICON Taiwan 2025 an innovative collaboration to develop an integrated optical interconnect. … read more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”17258″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/senko-bizlink-and-ficontec-partner-at-semicon-taiwan-2025-to-pioneer-advanced-optical-interconnect-manufacturing\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

June 2025
\n<\/span><\/p>\n

Product News – <\/span>ficonTEC Introduces Industry\u2019s First, ATE Agnostic, Top-Sided Electro-optical Wafer-level Tester<\/h3>\n

ficonTEC proudly announces the release of a new single-sided electro-optical wafer-level tester, a first-of-its-kind solution fully compatible with the world\u2019s two … read more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”16598″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ficontec-introduces-industrys-first-ate-agnostic-top-sided-electro-optical-wafer-level-tester\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

June 2025
\n<\/span><\/p>\n

Business News – <\/span>VLC Photonics and ficonTEC Showcase Advanced Automated Die-Level Testing & Assembly at Laser World of Photonics in Munich<\/h3>\n

VLC Photonics, a renowned photonic integrated circuit (PIC) design and test house (part of the Hitachi High-Tech Group), and ficonTEC, a leading provider of … read more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”10295″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/vlc-photonics-and-ficontec-showcase-advanced-automated-die-level-testing-and-assembly-at-laser-world-of-photonics-in-munich\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

March 2025
\n<\/span><\/p>\n

Product News – ficonTEC releases innovative wafer-level test cell to complement existing ATE
\n<\/span><\/h3>\n

ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonic … read more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”16100″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ficontec-releases-innovative-wafer-level-test-cell-to-complement-existing-ate\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

April 2024
\n<\/span><\/p>\n

Business\/Corporate – OFC 2024 sets stage for scaling next-generation integrated photonics manufacturing<\/span><\/h3>\n

OFC 2024 celebrates unprecedented visitor and exhibitor numbers and spotlights a thriving and rapidly evolving optical communications and networking industry following a year of intensive AI development … read more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”15462″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ofc-2024-sets-stage-for-the-important-role-of-integrated-photonic-assembly-packaging-and-test-solutions\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

February 2024
\n<\/span><\/p>\n

Photonics West 2024 reaffirms ficonTEC\u2019s technical roadmap<\/h3>\n

SPIE\u2019s Photonics West provides strong evidence for the continued maturity of the integrated photonics sector, with AI driving high demand for CPO devices and for ficonTEC\u2019s advanced automation packaging production solutions. The 2024 edition of SPIE<\/a>\u2019s ever successful Photonics West<\/a> conference and exhibition again staked claim to its prominent role on the global photonics stage by reporting excellent visitor feedback and record overall attendance to the combined event program. … read more<\/a><\/p>\n

 <\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”15210″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/photonics-west-2024-reaffirms-ficontecs-technical-roadmap\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

August, 2023
\n<\/span><\/p>\n

Fully Functional Co-packaged Optical Switch Satisfies Chipmakers\u2019 Need For Speed<\/h3>\n

ficonTEC has long been well known for its stand-alone photonics assembly & test development systems as well as more recently for the inline capability of its industrial photonic device manufacturing systems<\/a>. Both these capability suites have also long found favor in the telecom & datacom sector \u2013 indeed, ficonTEC R&D systems play an important role in NPI for many global players, and ficonTEC systems additionally make up around 50% of total global manufacturing capacity for the latest commercially available transceivers. \u2026 read more<\/a><\/p>\n

 <\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”14490″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/fully-functional-co-packaged-optical-switch\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

January, 2022<\/span><\/p>\n

Business\/Corporate \u2013 ficonTEC drives North America expansion with joint facility at UCF\/CREOL<\/h3>\n

ficonTEC reaffirms its commitment to its North American customers from\u00a02022 through the\u00a0establishment of a\u00a0new US facility within\u00a0CREOL\u00a0(The College of Optics and Photonics)<\/a>\u00a0at the\u00a0University of Central Florida (UCF)<\/a>. The new facility also gains a dedicated\u00a0Applications Lab that is designed to\u00a0provide process engineering support to\u00a0customers, to\u00a0renowned\u00a0research groups located at CREOL, through\u00a0collaborations with the\u00a0Florida Photonics Cluster,<\/a>\u00a0and with the broader\u00a0US photonics\u00a0industry \u2026 read more<\/a><\/p>\n

 <\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”11031″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ficontec-drives-north-america-expansion-with-joint-facility-at-ucf-creol\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

December, 2021<\/span><\/p>\n

Business\/Corporate \u2013\u00a0EPIC CEO Award 2021 goes to Torsten Vahrenkamp, interviewed by Jos\u00e9 Pozo, EPIC CTO<\/h3>\n

EPIC has announced the winner of the EPIC CEO Award 2021 as Torsten Vahrenkamp CEO and co-founder together with Matthias Trinker (CFO) of ficonTEC Service GmbH roughly 20 years ago. In the interview with Jos\u00e9, Torsten reveals some of the history re. ficonTEC\u2019s positioning, when he first encountered PICs, and provides some unique insights on this and other significant historical milestones in the growth of ficonTEC \u2026 read<\/a> and watch more<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”10956″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.youtube.com\/watch?v=eCeZdKwlz9Q&t=58s” link_target=”_blank” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

June, 2021<\/span><\/p>\n

Business\/Corporate \u2013 ficonTEC Ireland establishes core support for integrated photonics manufacturing<\/h3>\n

In a\u00a0move designed to underline the commitment to the developing eco-system in the\u00a0region, and indeed for Europe, ficonTEC has now established ficonTEC Ireland Ltd.\u00a0as a\u00a0unique entity and with a dedicated support team within the\u00a0Tyndall\u00a0National Institute<\/a>. ficonTEC Ireland is already a partner of the EU-funded\u00a0PhotonicLEAP<\/a>\u00a0\u2026 read more\u00a0\u2026\u00a0<\/a><\/p>\n

 <\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”10354″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ficontec-ireland-establishes-core-support-for-integrated-photonics-manufacturing” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

March, 2021<\/span><\/p>\n

Business\/Corporate \u2013\u00a0VLC Photonics receives new Wafer-level Test system\u00a0from ficonTEC<\/h3>\n

VLC\u00a0Photonics<\/a>,\u00a0based in Valencia, Spain,\u00a0\u00a0is now one of a growing list of established PIC eco-system\u00a0innovators to receive one of ficonTEC\u2018s new Wafer-level Test (WLT)\u00a0systems.\u00a0VLC\u00a0Photonics is a fabless photonic design house,\u00a0recently part of the\u00a0Hitachi High-Tech<\/a>\u00a0group,\u00a0offering varying services\u00a0for organizations seeking to exploit the advantages\u00a0of photonic integration \u2026 read more\u00a0\u2026\u00a0<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”9538″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/vlc-photonics-receives-new-wafer-level-test-system-from-ficontec\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

December, 2020<\/span><\/p>\n

Business\/Corporate \u2013 Investment agreement between ficonTEC Service and RoboTechnik Intelligent Technology<\/h3>\n

ficonTEC Service GmbH\u00a0has entered into a structured investment agreement with\u00a0RoboTechnik Intelligent Technology. This strategic move,\u00a0approved by the German authorities, has been implemented to promote the\u00a0continued business\u00a0success across all of ficonTEC\u2019s current and future fields\u00a0and regions of activities\u00a0\u2026 read more\u00a0<\/a>\u2026<\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”9021″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/investment-agreement-between-ficonte-service-and-robotechnik-intelligent-technology\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

November, 2020<\/span><\/p>\n

CustomLine CL1500 to support integrated photonics
\neco-system development at ORC, Tampere University<\/h3>\n

The latest update to our cooperation with the\u00a0Optoelectronics Research Centre (ORC)<\/a> at Tampere University (TAU)<\/a> going back some 15 years, is the delivery of a CustomLine CL1500 for active assembly tasks \u2026 read more<\/a> \u2026<\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”8942″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/customline-cl1500-to-support-integrated-photonics-eco-system-development-at-orc\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_row row_bg_type=”image” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

September, 2020<\/span><\/p>\n

ficonTEC and PHIX Photonics partner to enable high-volume manufacturing<\/h3>\n

In order to further enhance their ability to scale up production to better match customer needs, PHIX has commissioned ficonTEC to build flexible machine systems for a range of chip-to-chip assembly tasks. With these systems, PHIX is also in the position to offer process development and manufacturing services on ficonTEC equipment to ficonTEC customers. Process development, testing and scalable production can either take place at PHIX in Enschede, The Netherlands, or at the customer\u2019s own location. Read more \u2026<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”8300″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ficontec-and-phix-partner-to-enable-high-volume-manufacturing\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_row] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

April, 2020<\/span><\/p>\n

Statement \u2013 ficonTEC implements recommendations to help combat Covid-19<\/h3>\n

Dear valued customers and partners,
\nwe at ficonTEC are committed to showing and maintaining solidarity with the global efforts being made to combat the Covid-19 pandemic. Our first and foremost responsibility is toward the health and safety of our employees and their families at all of our locations in Germany, Ireland, Estonia, China, Thailand and US, additionally to our customers, suppliers and business partners around the globe, but also to the relevant regional communities and their \u2013 sadly \u2013 overburdened (health) services. Overall, we feel that there are two main areas where ficonTEC can address these responsibilities. Read more…<\/a><\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”6086″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/statement-ficontec-covid-19\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

March, 2020<\/span><\/p>\n

R&D \u2013 OptiK-Net to develop direct flexprint technology for cost-effective integration of optical waveguides and electronics<\/h3>\n

ficonTEC has entered into a collaboration tasked with the development of flex print technology for polymer-based optical waveguides for optical communications networks, and the application of the approach for the production of integrated electro-optical PDB-flexprint components for short-reach networks. The Optik-Net project<\/a> (available in German only) is funded by the Federal Ministry of Education & Research<\/a> ( in German, the BMBF ) and comprises nine different leading organizations located in Germany and Switzerland. Further information is available here<\/a> and here<\/a> (both available in German only).<\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”6057″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/rnd-optik-net-to-develop-direct-flexprint-technology\/” link_target=”_self” caption=”Source: ITA, Leibniz Universit\u00e4t Hannover” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

March, 2020<\/span><\/p>\n

Online video \u2013 ficonTEC delivers CL1500 in support of the largest cross-site R&D Cooperation for Micro- and Nanoelectronics in Europe<\/h3>\n

The Fraunhofer Group for Microelectronics in cooperation with the Leibniz institutes IHP<\/a> and FBH<\/a> together form the ‘Research Fab Microelectronics Germany’ (Forschungsfabrik Mikroelektronik Deutschland<\/a>). They offer a unique range of expertise and infrastructure that is designed to bridge the gap between basic research and customer-specific product development, with applications in LiDAR, 5G infrastructure, sensor systems and other opto-electronic systems. The ficonTEC CUSTOMLINE<\/a> system, featuring 9 different application modules, will assist with position-&-attach and pick-&-place tasks.<\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [spb_single_image image=”7333″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/ficontec-delivers-cl1500-in-support-of-the-largest-cross-site-rnd-cooperation-for-micro-and-nanoelectronics-in-europe\/” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

October, 2019<\/span><\/p>\n

New Corporate Vice President at ficonTEC<\/h3>\n

Strong demand for assembly and test systems for photonic devices has led ficonTEC to create a new position within top management to guide operative growth. Stefano Concezzi<\/a> takes over the role effective immediately \u2026 read more<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”5193″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/new-corporate-vice-president-at-ficontec\/” link_target=”_self” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

September, 2019<\/span><\/p>\n

ficonTEC at EPIC New Space event<\/span><\/h3>\n

Presentation made by Business Development Director Ignazio Piacentini<\/a>, recorded at the EPIC Meeting on New Space at ESA, Noordwijk, The Netherlands – September 12-13, 2019…read more<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”5125″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/vimeopro.com\/epicphotonics\/esa2019\/video\/359965814″ link_target=”_blank” width=”1\/3″ el_position=”last”] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

May, 2019<\/span><\/p>\n

Mixed-signal electro-optical\u00a0<\/span>I\/O testing for integrated photonics<\/span><\/h3>\n

ficonTEC Service GmbH of Achim, Germany, and Coherent Solutions Ltd. of Auckland, New Zealand, have entered into a collaborative partnership to advance electro-optical measurement capability for use in volume testing within the manufacturing cycle of integrated photonic devices (PICs) …read more<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”4536″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/mixed-signal-electro-optical-io-testing-for-integrated-photonics\/” link_target=”_self” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block icon=”ficonTEC to speak at 6th Workshop on Photonic Integrated Circuits at OFC, San Diego, CA\/USA” pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

April, 2019<\/span><\/p>\n

MASSTART \u2013 Mass manufacturing of transceivers for the Terabit\/s era<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

MASSTART<\/a> is an EU-funded H2020 project pursued by a consortium of renown European organizations. Coordinated by the Fraunhofer IZM, it is due to run from January 2019 for 36 months.<\/p>\n

The inherent issue of limited throughput and the associated high cost in photonics assembly & test processes is unsurprisingly a major hurdle to the introduction of new photonic developments into the consumer market, and one that can only be solved by cost-efficient assembly solutions. The MASSTART<\/a> project will tackle exactly this problem with a well-chosen consortium dedicated to the development of a high-throughput assembly line for transceivers…Read more<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”4410″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/masstart-mass-manufacturing-of-transceivers\/” link_target=”_self” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block icon=”ficonTEC to speak at 6th Workshop on Photonic Integrated Circuits at OFC, San Diego, CA\/USA” pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

March, 2019<\/span><\/p>\n

National Photonics Manufacturing Pilot Line<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

Tyndall National Institute and ficonTEC Service, along with other industry partners including Eblana Photonics<\/a>, Faz Technology<\/a>, mBryonics<\/a> and Sanmina<\/a>, have come together to build the National Photonics Manufacturing Pilot Line, an integrated photonics manufacturing ecosystem located within a single state-of-the-art facility and designed to advance disruptive photonic technologies from concept to commercialisation.<\/p>\n

The National Photonics Manufacturing Pilot Line, located in Tyndall, with an initial investment of \u20ac6m and a team of 15, will engage with sectors such as MedTech, Life Sciences and Communications. Tyndall is already the location of the PIXAPP Pilot Line Gateway<\/a> and the Irish Photonics Integration Centre<\/a>, which collectively represents over 160 photonics researchers and provides access to leading-edge technology, highly-skilled trainees and valuable infrastructure. Read more<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”4242″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/national-photonics-manufacturing-pilot-line\/” link_target=”_self” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block icon=”ficonTEC to speak at 6th Workshop on Photonic Integrated Circuits at OFC, San Diego, CA\/USA” pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

February, 2019<\/span><\/p>\n

InPulse \u2013 Indium-Phosphide Pilot Line<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

InPulse is an EC-funded H2020 Manufacturing Pilot Line project for photonic integrated circuits (PICs) utilizing indium phosphide (InP), starting January 2019 and running for 48 months. InP PICs offer game-changing performance capabilities across multiple market sectors. The goal of InPulse is to put in place the technological and operational processes to accelerate the uptake of PIC technology in new markets, align scalable and interlocking services and value chains, accelerate time to market with predictive design for fewer and faster design cycles, and to offer foundry processes at TRL7, sharing process optimization across products.<\/p>\n

Within InPulse, ficonTEC will drive forward the acceleration and standardization of PIC test procedures to high-throughput processes that are compatible across measurement domains. This will be accomplished using customizable, yet standardized scripting formats for testing and characterization on the optical and radio-frequency domain. Testing can be accelerated by utilizing state-of-the-art robotic handling and highly-optimized optical alignment procedures.<\/p>\n

Access to InPulse<\/a> technology is via JePPIX<\/a>, the Joint European Platform for Photonic Integrated Components and Circuits.<\/p>\n[\/spb_text_block] [spb_single_image image=”4290″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.ficontec.com\/inpulse-indium-phosphide-pilot-line\/” link_target=”_self” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block icon=”ficonTEC to speak at 6th Workshop on Photonic Integrated Circuits at OFC, San Diego, CA\/USA” pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

February, 2019<\/span><\/p>\n

ficonTEC to speak at 6th Workshop on Photonic Integrated Circuits at OFC, San Diego, CA\/USA<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

The advent of 100Gbps and beyond in both longhaul as well as datacom marked the breakthrough of photonic integration in a broader sense. As a result of this, PICs are now also being used e.g. in sensing, life sciences, and military applications and there is thus a growing group of people that are starting to design and use photonic chips. However, the PIC value chain can be complex as one needs to make choices for the material system, the foundry and\/or broker, the design and layout software, assembly and packaging solutions and so on. The aim of the PIC workshop<\/a> is to bring together all the relevant players independent of material system and to provide an in-depth overview that allows you to make the right trade offs and to get to know the key PIC service providers.<\/p>\n

Torsten Vahrenkamp<\/a>, ficonTEC\u2019s CEO, will give a talk within the Packaging session.
\nVenue: Room 29ABCD at the San Diego Convention Center, Wednesday March 6, 2019, 5:45 – 8:30pm<\/p>\n[\/spb_text_block] [spb_single_image image=”4280″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.7pennies.com\/news-events\/pic-workshop-ofc-2019\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

February, 2019<\/span><\/p>\n

TERIPHIC \u2013 Moving on to Terabit transceiver modules, and how to assemble them<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

As part of its on-going and intensive involvement in international, publicly funded R&D projects, ficonTEC R&D announces its involvement in TERIPHIC, an EU H2020 project starting January 2019 and due to run for 36 months. Having kicked-off in January in Berlin, the goal is to go beyond current 400G transceiver module standards and push development to Terabit transceiver modules having at least 2km reach. To achieve this, TERIPHIC will leverage photonic integration concepts and develop a seamless chain of component fabrication, assembly automation and module characterization processes as the basis for high-volume production lines.<\/p>\n[\/spb_text_block] [spb_single_image image=”4220″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.youtube.com\/watch?v=Agr9U84DC_c” link_target=”_blank” width=”1\/3″ el_position=”last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

ficonTEC will contribute by optimizing assembly processes and hardware on a ficonTEC CL1500 system already in use at the Fraunhofer HHI, thus supporting the development of the required automated assembly hardware appropriate for high-volume manufacturing for as yet to be detailed module-specific align-&-attach processes. In the final stages of the project, ficonTEC will put forward a concept for the entire high-volume production line. Ultimately, the new transceiver design introduced by TERIPHIC will allow significant cost savings, not only due to assembly automation at the TOSA\/ROSA stage, but also at the packaging level, and resulting in a cost below 1\u20ac\/Gbps for the transceiver modules.
\nMore details can be found at Fraunhofer HHI<\/a> and via the EC’s CORDIS website<\/a>.<\/p>\n[\/spb_text_block] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

January, 2019<\/span><\/p>\n

ficonTEC to host PhotonicNet\u2019s ‘Aufbau – und Verbindungstechnik’ Workshop<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

F\u00fcr die Entwicklung wettbewerbsf\u00e4higer Produkte wie z.B. Smartphones, sind heute Technologien zur Erh\u00f6hung der Integrationsdichte und Systemintegration Voraussetzung. Die Anforderungen an Komponenten wie Leiterplatten und somit an die Fertigung haben sich in den letzten Jahren extrem gewandelt. Ziel des Workshops ist es, einen \u00dcberblick \u00fcber die neusten Entwicklungen im Bereich des Packaging zu geben. Neben allgemeinen Trends in der Aufbau- und Verbindungstechnik liegt der diesj\u00e4hrige Schwerpunkt in der Produktion und Automatisierungstechnik f\u00fcr die Herstellung von optoelektronischen Komponenten. Der Workshop richtet sich sowohl an Entwickler als auch an Anwender aus den Bereichen Laser Packaging, Optik, Elektronik und Mikrosystemtechnik.<\/p>\n[\/spb_text_block] [spb_single_image image=”4214″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/photonicnet.de\/veranstaltungen\/veranstaltung\/aufbau-und-verbindungstechnik-833\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

January, 2019<\/span><\/p>\n

ficonTEC to speak at 4th PIC Training, Santa Clara, CA\/USA<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

After three successful PIC Training workshops in 2015 – 2017, a fourth\u00a0training has now organized<\/a>, this time in Santa Clara, CA\/USA. Taking place in the week before Photonics West 2019, during the training\u00a0participants will simulate, design, and layout PICs using a range of software tools. The training also\u00a0addresses all key material systems (Si Photonics, InP-based, SiO2\/Si3N4). The program has the full support of\u00a0over 20 companies that span the complete photonic integration ecosystem, and includes several industry guest\u00a0speakers as well as extensive networking opportunities, for example, in the form of facilitated group dinners.\u00a0Ignazio Piacentini<\/a>,\u00a0ficonTEC\u2019s Director of Business Development, presents as Industry\u00a0Guest\u00a0Speaker on Thursday, Jan. 31.<\/p>\n[\/spb_text_block] [spb_single_image image=”1847″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.7pennies.com\/news-events\/pic-training-silicon-valley-2019\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

December, 2018<\/span><\/p>\n

iQonic project technology provider<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

ficonTEC is part of iQonic project<\/a> and is fulfilling the role of technology provider. The company has wide experience with photonics assembly and testing processes and it is supporting the project in the design of a reconfigurable process chain and in the developement of a new type of handling tool interface for optoelectronic assembly processes.<\/p>\n

iQonic consortium gathered to visit ficonTEC facilities in Achim, Germany. The agenda of the day included an introduction into ficonTEC, a guided tour through the assembly hall of the company and a final open technical discussion among the partners.<\/p>\n[\/spb_text_block] [spb_single_image image=”4171″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/www.iqonic-h2020.eu” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

December, 2018<\/span><\/p>\n

Beckermus Technologies & ficonTEC to promote relationship<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

Beckermus Technologies Ltd.<\/a> is the leading micro-assembly services provider in Israel. By utilizing ficonTEC photonics assembly and test machines as part of their manufacturing system toolkit, Beckermus supplies micro-electronics, micro-optics and photonic device assembly\u00a0services to customers worldwide. As part of an on-going relationship together with ficonTEC, Beckermus recently purchased a CL1500 machine system<\/a> equipped for active alignment. ficonTEC\u2019s\u00a0CustomLine<\/a> products are a range of modular, multi-purpose assembly and test cells sporting the largest range of optional modules available to any ficonTEC platform. Both organizations have agreed to give the relationship more visibility, both publicly in print\/online, as well as in presentations given at trade events and conferences. For further information on the services provided by Beckermus, visit\u00a0www.beckermus.com.<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”4152″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.beckermus.com” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

December, 2018<\/span><\/p>\n

Further projects and collaborations for ficonTEC<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

ficonTEC continues to expand its involvement in international projects & initiatives dedicated to the development of photonic device manufacturing, making vital contributions to progress and at the same time helping ficonTEC to stay ahead of evolving industry manufacturing needs.<\/p>\n

Firstly, CALADAN<\/a> will demonstrate how integration of lasers and electronics onto a PIC can be done fully at the wafer-level using the established micro-transfer printing technique, thus eliminating this assembly bottleneck. GaAs quantum dot lasers and 130nm SiGe BiCMOS 56Gbaud-capable driver and receiver\u00a0electronics will be transfer printed onto silicon photonic 300mm wafers. Starting from proven concepts in PIXAPP<\/a>, a novel fast fiber attachment\u00a0process will be demonstrated that reduces the time required for fiber attachment by an order of magnitude.<\/p>\n[\/spb_text_block] [spb_single_image image=”4161″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/cordis.europa.eu\/project\/rcn\/219123_en.html?WT.mc_id=RSS-Feed&WT.rss_f=project&WT.rss_a=219123&WT.rss_ev=a” link_target=”_blank” width=”1\/3″ el_position=”last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

Secondly, as part of the\u00a0Disruptive Technologies Innovation Fund (DTIF)<\/a> in Ireland, \u20ac4,1m has been given to support a physical Photonic Packaging Pilot Line designed to fill the gap that exists today, i.e. to\u00a0fabricate tens to hundreds of units. The Photonic Packaging Pilot Line Hub will a) develop packaging designs tailored to fast\u00a0cost-effective packaging processes and equipment and b) develop and install next generation packaging equipment\u00a0(including test) with reduced cycle-times. This is just one of many of ficonTEC\u2019s collaborations together with the Tyndall National Institute<\/a>.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

November, 2018<\/span><\/p>\n

PIC Players Meeting<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

As part of the ‘Photonic Integration Week<\/a>\u2019 Event, to be held on\u00a0January 14-15, 2019, in Valencia, Spain, Torsten Vahrenkamp, Owner\/CEO at ficonTEC Service GmbH, will present the latest developments for assembly\u00a0and test of integrated optics devices. PIW brings together experts around photonic integration technologies for tele\/datacom, sensing and bio-technology\u00a0applications, and 2019 will be it’s 3rd meeting.<\/p>\n[\/spb_text_block] [spb_single_image image=”4126″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/piw.webs.upv.es\/index.php\/2018\/11\/05\/torsten-vahrenkamp-piw-2019-photonic-device-assembly-and-test-solutions-for-the-next-generation-integrated-optics\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

September, 2018<\/span><\/p>\n

Product News<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

ficonTEC Service GmbH of Achim, Germany, has announced a comprehensive modernization of their product strategy. The new strategy allows ficonTEC to properly address increasing customer focus on in-line production line applications, while at the same time retaining continuity for existing customers, commitments and projects with current stand-alone machines. Read more<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”4018″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

August, 2018<\/span><\/p>\n

ficonTEC sees Rapid Growth in Asia<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

With the global installation base hitting 500 machines only last summer, ficonTEC has now easily sailed past the 600 mark within the first half of 2018. A major contribution to this growth originates with demand in the Far East, in particular China: For Silicon Photonics assembly and testing applications, more than 20 fully-automatic systems have been delivered in 2018 alone, and in the same timeframe, the overall installation base within China has increased more than 50% over 2017. Lastly, in 2018 the first fully-automatic packaging production line was successfully installed.<\/p>\n

To find out what ficonTEC can do for your photonics assembly application, come and talk to us at CIOE (www.cioe.cn<\/a>, Booth #1A13-8), Sept. 5 – 8 in Shenzhen, PR China.<\/p>\n[\/spb_text_block] [spb_single_image image=”3759″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/www.cioe.cn\/en\/index.html” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

April, 2018<\/span><\/p>\n

Zukunftstag – Future Day 2018<\/h3>\n

ficonTEC actively support the training of young people. It is never too early to raise interest for technical job profiles. For instance through various events like the Future Day which took place last week. We again offered an interesting programme and provided a deep insight into our company. By participating into the Future Day more and more young people are gaining entry to the MINT disciplines. The future is now!<\/p>\n[\/spb_text_block] [spb_single_image image=”3298″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/www.lower-saxony.de\/startseite\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

February, 2018
\n<\/span><\/p>\n

PIC Awards Finalist<\/h3>\n

ficonTEC has been chosen as a finalist for the PIC Awards 2018. This award recognises advances in the development and application of key materials systems driving today\u2019s photonic integrated circuits and providing a stepping stone to future devices. The PIC Awards will take place at PIC International conference on the 10th April 2018, Brussels.<\/p>\n[\/spb_text_block] [spb_single_image image=”3066″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/www.picawards.net” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

December, 2017
\n<\/span><\/p>\n

New ficonTEC Subsidiary<\/h3>\n

ficonTEC Eesti has expanded their staff count. As of the end of 2017 there are now seven employees based in the new office in Tallinn\u2019s Tehnopol Center (in Estonia).<\/p>\n[\/spb_text_block] [spb_single_image image=”1961″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/binged.it\/2CL0KkP” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

December, 2017
\n<\/span><\/p>\n

VDMA\/EMINT<\/h3>\n

ficonTEC becomes member of VDMA sector association EMINT<\/p>\n[\/spb_text_block] [spb_single_image image=”1449″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/emint.vdma.org\/viewer\/-\/article\/render\/22573408″ link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

December, 2017<\/span><\/h4>\n

ficonTEC contributes to PIXAPP pilot line<\/h3>\n

PIXAPP is the world\u2019s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line and helps users exploit the breakthrough advantages of PIC technologies. PIXAPP<\/a> consists of a highly-interdisciplinary team of Europe\u2019s leading industrial & research organizations and provides users with single-point access to PIC assembly and packaging. PIXAPP<\/a> bridges the \u2018valley of death\u2019 often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.<\/p>\n

Within PIXAPP, ficonTEC develops a cross-platform beyond state-of-the-art PIC wafer and die level tester. The double-sided fiber alignment engine will be capable of performing ultrafast coupling and transmission measurements on a variety of platforms like, e.g., silicon on insulator, InP, and TripleX. In addition, a general and modular assembly concept will be developed on which all demonstrators within PIXAPP<\/a> from telecom, Datacom, BioSensor as well as fiber Sensors can be assembled.<\/p>\n

 <\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/3″ el_position=”last”] [blank_spacer height=”50px” width=”1\/1″ el_position=”first last”] [spb_single_image image=”1303″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”yes” image_link=”..\/projects-initiatives” link_target=”_self” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

November, 2017<\/span><\/h4>\n

Supplier Award<\/h3>\n

ficonTEC has been honored with the 2017 Supplier Award from a leading global information and communication technologies solutions provider.<\/p>\n[\/spb_text_block] [spb_single_image image=”1768″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”yes” image_link=”http:\/\/emint.vdma.org\/viewer\/-\/article\/render\/22573408″ link_target=”_self” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

November, 2017<\/span><\/h4>\n

ficonTEC R&D Center<\/h3>\n

ficonTEC\u2019s new R&D Center had its opening. Not far from ficonTEC\u2019s Headquarters, the new R&D Center has expanded into new premises, thus allowing us to secure innovative product developments in cooperation with both customers and funded projects.<\/p>\n

 <\/p>\n

 <\/p>\n[\/spb_text_block] [spb_single_image image=”2953″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” link_target=”_self” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

May, 2017<\/span>
\n<\/strong><\/h4>\n

EPIC workshop in Achim<\/h3>\n

ficonTEC successfully hosted an hosted EPIC workshop<\/a>. The purpose of this workshop was to bring to together equipment manufacturers and SMEs to discuss the small- and medium-volume production of opto-electronic components, and to identify potential bottlenecks in process automation.<\/p>\n[\/spb_text_block] [spb_single_image image=”1619″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/www.epic-assoc.com\/automation-for-fabrication-and-testing-of-optoelectronics\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

May, 2017<\/span><\/h4>\n

ficonTEC: winner of Digitalisation Award<\/h3>\n

Digitalisation und Industry 4.0 are terms that are on everyone\u2019s lips. However, their importance and the dimension of upcoming changes have not yet arrived in the minds of corporate management and in corporate practice. A digital strategy is the first step into the direction of digital transformation.<\/p>\n

Opto-electronics has become one of the most important of these innovative driving forces.<\/p>\n

ficonTEC won the ARTIE innovation award in the category \u2018digitalisation\u2019 during the ARTIE Expert Conference 2017<\/a> , and is proud of having been honored as a company with high innovative strength in the region. ARTIE is a regional network for technology, innovation and development. Read more<\/a><\/p>\n[\/spb_text_block] [spb_single_image image=”1969″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/www.artie.eu\/2017\/05\/nachlese-3-artie-fachkongress\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

March, 2017<\/span><\/h4>\n

Rewarding excellence, innovation and success within the photonic integrated circuit industry<\/h3>\n

ficonTEC has been chosen as a finalist for the PIC Awards 2017 by the PIC Awards governing committee in the category \u2018Advances in Manufacturing\u2019. The awards ceremony will take place at PIC International Conference on March 7, 2017, Brussels, Belgium.<\/p>\n[\/spb_text_block] [spb_single_image image=”1459″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”http:\/\/www.picawards.net\/home” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

2017<\/span><\/h4>\n

Trade shows<\/h3>\n

During the trade shows smt and Sensor + Test in Nuremberg, as well as Laser World of Photonics and Productronica in Munich, ficonTEC presented the latest trends to industry experts. The focus for all events was on demonstrating innovative developments and the latest applications. This was supported by a live machine demonstration, where interested visitors got the chance to take a peek at the complexity of the individual systems. More events<\/a><\/p>\n

Various other events in USA, China, Israel and Sweden also offered our guests fascinating insights into the world of photonics.<\/p>\n[\/spb_text_block] [spb_single_image image=”5539″ image_size=”large” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”yes” image_link=”..\/events” link_target=”_self” width=”1\/3″ el_position=”last”] [\/spb_column] [blank_spacer height=”30px” spacer_id=”newsletter” spacer_name=”newsletter” width=”1\/1″ el_position=”first last”] [spb_row wrap_type=”content-width” row_bg_type=”image” color_row_height=”content-height” bg_image=”2487″ bg_type=”cover” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”lightgrid” row_overlay_opacity=”50″ row_padding_vertical=”50″ row_padding_horizontal=”0″ row_margin_vertical=”0″ remove_element_spacing=”no” inner_column_height=”col-natural” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”3\/4″ el_position=”first last”]\n

ficonPRESS newsletter<\/h2>\n

Stay in touch with ficonTEC and receive invitations, announcements and the latest news.<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”3\/4″ el_position=”first last”]\n