Here we provide a list \u2013 in English \u2013 of important press coverage going back over the last few years. These items highlight ficonTEC’s growth and developments, as well as collaborations and projects. More details can be gained by simply following the links or by getting in touch via the details given in the footer below.<\/p>\n[\/spb_text_block] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”]\n
2022<\/span><\/p>\n 99 von 100 m\u00f6glichen Punkten hat Dominic M\u00e4hling in seiner Abschlussarbeit erzielt. Damit\u00a0war der Mikrotechnologie-Azubi der Achimer Firma Ficontec bundesweit der Beste und wurde\u00a0daf\u00fcr jetzt ausgezeichnet \u2026 mehr lesen<\/a><\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [spb_single_image image=”12811″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.kreiszeitung.de\/lokales\/verden\/achim-ort44553\/bundesbester-azubi-91356077.html” link_target=”_blank” width=”1\/3″ el_position=”last”] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”]\n 2020<\/span><\/p>\n Cork\u2019s Tyndall National Institute is collaborating with German photonics equipment manufacturer, ficonTEC, to develop manufacturing\u00a0solutions that transfer breakthroughs in their research to immediate industrial impact. The company offically set up a new research team\u00a0in Tyndall last October \u2026 read more<\/a><\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [spb_single_image image=”11001″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.tyndall.ie\/news\/cork-researchers-partner-with-german-photonics-firm-to-bring-breakthroughs-to-industry\/” link_target=”_blank” width=”1\/3″ el_position=”last”] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”]\n 2020<\/span><\/p>\n This video provides brief coverage of ficonTEC\u2018s photonics assembly & test system portfolio, software for\u00a0process control, and so too of the demo systems exhibited at Photonics West 2020. Presented by Arne\u00a0Bentfeldt, Product Manager \u2026 watch here<\/a><\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [spb_single_image image=”15761″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/player.vimeo.com\/video\/392000449?portrait=0″ link_target=”_blank” caption=”Source: vimeo.com\/video\/392000449″ width=”1\/3″ el_position=”last”] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”]\n 2020<\/span><\/p>\n Irish companies are playing a growing role in exploring the possibilities of this key technology with the help of\u00a0significant investment from the Government\u2019s \u20ac500 million\u00a0Disruptive Technologies Innovation Fund (DTIF) <\/a> as well as university research programs. The DTIF is also pivotal in ficonTEC\u2019s involvement in the integrated photonics eco-system development within Ireland \u2026 read more<\/a><\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [spb_single_image image=”8970″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/globalambition.ie\/dtif-pilot-photonics” link_target=”_blank” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”]\n 2020<\/span><\/p>\n Researchers have developed a new way to build power-efficient and programmable integrated switching units on a silicon photonics chip. The new\u00a0technology is poised to reduce production costs by allowing a generic optical circuit to be fabricated in bulk and then later programmed for specific\u00a0applications such as communications systems, LIDAR circuits or computing applications.<\/p>\n More information on the goals and achievements of the Silicon Photonics Group can be found\u00a0online<\/a><\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [spb_single_image image=”7811″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” image_link=”https:\/\/www.biophotonics.world\/magazine\/article\/1083\/configurable-circuit-technology-poised-to-expand-silicon-photonic-applications” link_target=”_self” width=”1\/3″ el_position=”last”] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”]\n 2020<\/span><\/p>\n The goal of this international gathering was to update and discuss the first draft of Integrated Photonic Systems Roadmap \u2013 International (IPSR-I), looking ahead to global technology needs as far ahead as 2040. Head of Business Development Ignazio Piacentini took part in the forum and gave a presentation<\/a> on ficonTEC\u2019s R&D&I initiatives and prospects for the future.<\/p>\n More information on the goals and achievements of the fourm can be found online<\/a>.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2020<\/span><\/p>\n A German consortium develops a modular technology platform for integrated photonics, along with a supporting value chain. ficonTEC\u2019s involvement includes a CustomLine assembly system<\/a> for PolyPhotonics Berlin.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2019<\/span><\/p>\n An article written largely by experts from CEA-Leti,\u00a0whose\u00a0silicon\u00a0photonics program has been working with\u00a0numerous academic and industrial partners\u00a0since from about\u00a02005. The article looks\u00a0at some of the remaining requirements in the silicon photonics eco-system, in particular those needed for adoption of wafer-level approaches in coupling and device characterization.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2019<\/span><\/p>\n Die Industrie- und Handelskammer Niedersachsen hat die 22-J\u00e4hrige Hanne Tydeks bei einer Feierstunde in Oldenburg als eine der landesweit besten Auszubildenden in kaufm\u00e4nnischen und gewerblich-technischen Berufen geehrt.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2019<\/span><\/p>\n Read about how ficonTEC\u2019s involvement in international R&D initiatives will help contribute to reduced carbon emissions: ‘Researchers use photonics to develop low-emission 1.6 TB\/s internet’<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2019<\/span><\/p>\n In this article, Andy Extance enquires about the many challenges that need to be overcomein order to provide quick and efficient (i.e. high-volume-capable) characterisation of PICs (photonic integrated circuits).<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2019<\/span><\/p>\n In this article Jose Pozo, EPIC<\/a>‘s CTO talks to Torsten Vahrenkamp, CEO of ficonTEC about the past, present and future of ficonTEC and the challenges for active alignment assembly of photonics systems.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2019<\/span><\/p>\n Tyndall National Institute<\/a> in Cork is leading a new international consortium which will provide Europe with state-of-the-art photonics infrastructure. The value of the photonics market is expected to be worth over \u20ac615bn by 2020 and with Europe\u2019s share of the production technology market currently at 55%, Tyndall\u2019s new consortium PIXAPP<\/a> will play a critical role in future economic development.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2019<\/span><\/p>\n Photonics technology is undergoing a transition toward greater integration, with multiple functionality and components being combined onto a single chip or within a small hybrid assembly \u2013 also known as a photonic integrated circuit, or PIC.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2018<\/span><\/p>\n Are there any products that you are highlighting today? What makes your products unique in the marketplace? Which industries do your products serve?<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2016<\/span><\/p>\n Torsten Vahrenkamp, CEO, speaks at the OSA\u2019s OIDA Workshop on Integrated Photonics High Volume Packaging, in Anaheim, CA\/USA. The workshop takes place during OSA\u2019s centenary year.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2015<\/span><\/p>\n ficonTEC joins Integrated Photonics Manufacturing Innovation Hub consortium. Bridging the gap between applied research and product development, each hub brings together companies, universities, other academic and training institutions, and Federal agencies to co-invest in key emerging technology areas that can encourage investment and production.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2014<\/span><\/p>\n ficonTEC sponsors the 1st Optical Interconnect in Data Centers Symposium, which took place in Berlin in March 2014.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2013<\/span><\/p>\n Matthias Trinker, Chief Financial Officer of ficonTEC Service GmbH, has been recognized for showing dedication, leadership and excellence in finance.<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n 2010<\/span><\/p>\n In a further expansion move designed to support the rapid growth, ficonTEC has moved into new headquarters. With an increased demand for solutions of automated photonic assembly projects, the company needed a more efficient and larger manufacturing space. The new facility offers a sufficient capacity to address the boost from the introduction of the company\u2019s latest micro assembly platform<\/p>\n<\/i>More info<\/span><\/a>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”2\/3″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\nNews \u2013 Azubi von Ficontec wird als Bundesbester\u00a0ausgezeichnet<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n
News \u2013 The Tyndall National Institute creates a global gateway for photonics research<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n
Video \u2013 A quick video shoot of ficonTEC at the 2020 Photonics West<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n
Article \u2013 Pilot Photonics combines Irish lasers and the internet of the future<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n
Article \u2013 Wafer Testing System at Southampton University\u2019s Cornerstone<\/a> bears first fruits for Silicon Photonics<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n
Collaboration \u2013 Participation in the World Technology Mapping Forum, Berlin 2019<\/h3>\n
Article \u2013 Integrated Photonics: Hybrid integrated photonics cultivate a value chain<\/h3>\n
Article \u2013 Silicon photonics market growth depends on maturing processes and overcoming TAP challenges<\/h3>\n
Interview \u2013 Auszeichnung mit Bestnote f\u00fcr Hanne Tydeks, ficonTEC R&D<\/h3>\n
Article – ficonTEC\u2019s involvement in international R&D initiatives<\/h3>\n
Article – Some of the challenges facing high-volume photonic device assembly<\/h3>\n
Article – EPIC interviews CEO of ficonTEC<\/h3>\n
Interview \u2013 Tyndall Institute, National Photonics Manufacturing Pilot Line<\/h3>\n
Article – High volume automated PIC assembly and testing<\/h3>\n
Interview – SENSOR+TEST 2018<\/h3>\n
Workshop – Integrated Photonics<\/h3>\n
Project – Integrated Photonics Manufacturing<\/h3>\n
Symposium – 1st Optical Interconnect in Data Centers<\/h3>\n
Awards – Accomplishments in Finance<\/span><\/h3>\n
Corporate – New headquarters<\/span><\/h3>\n