{"id":16094,"date":"2025-03-27T13:01:15","date_gmt":"2025-03-27T12:01:15","guid":{"rendered":"https:\/\/www.ficontec.com\/?p=16094"},"modified":"2025-03-27T13:12:15","modified_gmt":"2025-03-27T12:12:15","slug":"ficontec-releases-innovative-wafer-level-test-cell-to-complement-existing-ate","status":"publish","type":"post","link":"https:\/\/www.ficontec.com\/cn\/ficontec-releases-innovative-wafer-level-test-cell-to-complement-existing-ate\/","title":{"rendered":"ficonTEC releases innovative wafer-level test cell to complement existing ATE"},"content":{"rendered":"[blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

March 2025<\/span><\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

Product News<\/span>\u00a0 – ficonTEC releases innovative wafer-level test cell to complement existing ATE<\/h2>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

An industry first, ficonTEC\u2019s new 300\u00a0mm double-sided electro-optical wafer tester is compatible with existing semiconductor ATE architectures and is targeted at AI-driven silicon photonics computing demand.<\/p>\n

With immediate availability, this ground-breaking new technology enables high-throughput testing of silicon photonic integrated circuit (PIC) devices at wafer level. These devices are at the heart of the co-packaged optics (CPO) enabled photonic engines featured in the highest performance optical interconnects used within data centers. By implementing broad compatibility with existing ATE architectures, rapidly adoptable test capability is now commercially available for all major foundries facing the surging demand for contemporary and for recently announced next-generation CPO.<\/p>\n

\"\"

ficonTEC\u2019s new wafer tester is compatible with semiconductor ATE to provide double-sided electro-optical PIC wafer testing<\/p><\/div>\n

This new optical test cell directly docks with the ATE at a core software and hardware level, enabling DC and high-data-rate test capability on the top side and precision optical six-axis active alignment probing below. It also accommodates automatic wafer loading and incorporates a patented vacuum thermal control chuck assembly, in-situ<\/em> fiber array calibration, end-face inspection, high-speed probe calibration, and automated PIC mapping.<\/p>\n

Adoption is already in progress by a number of market leading chip manufacturers and foundries, noting that ficonTEC\u2019s intention here is to maintain a broad and open compatibility with all leading ATE manufacturers. Further near-term activities will include developments for single-sided wafer formats as well as for die-level and module-level production test.<\/p>\n

ficonTEC has established a global Sales & Service network that already serves around 1400 installed machine systems around the world \u2013 a good proportion of those systems have long contributed to the manufacture of high-end interconnect chiplets, and newer systems support the CPO-enabled formats currently utilized in 400G, 800G, 1.6T interconnects and beyond. ficonTEC is currently expanding its support network \u2013 in particular in Taiwan, Korea, Israel and USA \u2013 and boosting its presence globally to effectively address the rapidly accelerating take-up of new technology in the AI computing sector.<\/p>\n

\"\"

ficonTEC production process capability can be found throughout the co-packaged optical chiplet R&D and manufacturing workflow<\/p><\/div>\n

The new test cell and its variants form an integral part of ficonTEC\u2019s evolving production capabilities specifically targeted at the CPO-enabled optical chiplet manufacturing workflow. For the first time, a complete suite of highly cost-effective tools is now available for the entire CPO test and hybridization workflow, beginning with wafer-level PICs, continuing through die-level processes and ending with end-of-line packaging and module test. This production suite is essential in enabling new manufacturing benchmarks to be set for yield, time to market and ultimately TCO.<\/p>\n

To find out more about manufacturing strategies for integrated photonics, find us at OFC 2025 in San Francisco (#5401), get in touch<\/a> or follow us on LinkedIN<\/a>.<\/p>\n<\/i>Contact us<\/span><\/a>\n[\/spb_text_block]\n","protected":false},"excerpt":{"rendered":"

[blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”] March 2025 [\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”] Product News\u00a0 – ficonTEC releases innovative wafer-level test cell to complement existing ATE [\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”] ficonTEC reveals an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE and targeted at AI-driven silicon photonics […]<\/p>\n","protected":false},"author":1,"featured_media":15210,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[135,15],"tags":[21,37,247,281,236,279,123,53,170,280,278,244,246,56,245,121],"class_list":["post-16094","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-corporate","category-new","tag-ai","tag-artificial-intelligence","tag-assembly-test","tag-ate","tag-co-packaged-optics","tag-cpo","tag-datacom","tag-high-volume","tag-integrated-photonics","tag-interconnects","tag-ofc-2025","tag-optical-communications","tag-osat","tag-pic","tag-pluggables","tag-silicon-photonics"],"yoast_head":"\nficonTEC releases innovative wafer-level test cell to complement existing ATE - 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