{"id":18478,"date":"2026-07-06T10:26:52","date_gmt":"2026-07-06T08:26:52","guid":{"rendered":"https:\/\/www.ficontec.com\/?p=18478"},"modified":"2026-09-15T12:53:30","modified_gmt":"2026-09-15T10:53:30","slug":"seminar-asia","status":"publish","type":"post","link":"https:\/\/www.ficontec.com\/cn\/seminar-asia\/","title":{"rendered":"Seminar &#8211; Asia"},"content":{"rendered":"[spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;3\/4&#8243; el_position=&#8221;first last&#8221;]\n<h1><span style=\"color: #841585;\">Thank you very much for participating<\/span><\/h1>\n<h3>A big thank you to everyone who visited the ficonTEC Expert Seminar ASIA.<\/h3>\n<p>Here is a brief summary of this year&#8217;s event at Semicon in Taiwan. We look forward to welcoming you again next year as a guest or speaker. Once again, many thanks to all participants.<\/p>\n[\/spb_text_block] [spb_row wrap_type=&#8221;content-width&#8221; row_bg_type=&#8221;color&#8221; row_bg_color=&#8221;#f7f7f7&#8243; color_row_height=&#8221;content-height&#8221; bg_type=&#8221;cover&#8221; parallax_image_height=&#8221;content-height&#8221; parallax_image_movement=&#8221;fixed&#8221; parallax_image_speed=&#8221;0.5&#8243; parallax_video_height=&#8221;window-height&#8221; parallax_video_overlay=&#8221;none&#8221; row_overlay_opacity=&#8221;0&#8243; row_padding_vertical=&#8221;30&#8243; row_padding_horizontal=&#8221;0&#8243; row_margin_vertical=&#8221;0&#8243; remove_element_spacing=&#8221;no&#8221; inner_column_height=&#8221;col-natural&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<div style=\"width: 1280px;\" class=\"wp-video\"><video class=\"wp-video-shortcode\" id=\"video-18478-1\" width=\"1280\" height=\"720\" poster=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/seminar-thumb-1.jpg\" preload=\"metadata\" controls=\"controls\"><source type=\"video\/mp4\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ficonTEC-Semicon26-Expert-Seminar.mp4?_=1\" \/><a href=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ficonTEC-Semicon26-Expert-Seminar.mp4\">https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ficonTEC-Semicon26-Expert-Seminar.mp4<\/a><\/video><\/div>\n[\/spb_text_block] [\/spb_row] [spb_accordion active_section=&#8221;0&#8243; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;] [spb_accordion_tab title=&#8221;KEYNOTE&#8221; accordion_id=&#8221;&#8221; icon=&#8221;&#8221;] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<h2 style=\"text-align: center;\"><span style=\"color: #841585;\">&#8220;The Future is Powered by Photonics<\/span><br \/>\n<span style=\"color: #841585;\">Building the Manufacturing Ecosystem Behind AI Infrastructure&#8221;<\/span><\/h2>\n<p class=\"\" style=\"text-align: center;\">Date:<br \/>\n<span style=\"color: #841585;\">Tuesday, September 8th, 2026 &#8211; 9 am to 5 pm, CST<\/span><\/p>\n<p class=\"\" style=\"text-align: center;\"><span style=\"color: #333333;\">Location:<br \/>\n<span style=\"color: #841585;\">Hsinchu, Taiwan<\/span><\/span><\/p>\n[\/spb_text_block] [\/spb_accordion_tab] [spb_accordion_tab title=&#8221;AGENDA&#8221; accordion_id=&#8221;&#8221; icon=&#8221;&#8221;] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<table class=\"sf-table standard_minimal\"><tbody>\n<tr>\n<th>Timing<\/th>\n<th>Topic<\/th>\n<th>Presenting company<\/th>\n<\/tr>\n<tr>\n<td>8:30-09:00<\/td>\n<td>Registration, Coffee<\/td>\n<td><\/td>\n<\/tr>\n<tr>\n<td>9:00-9:10<\/td>\n<td>Welcome<\/td>\n<td>ficonTEC<\/td>\n<\/tr>\n<tr>\n<td>09:10-9:35<\/td>\n<td><span style=\"color: #841585;\">Keynote: The Future is Powered by Photonics &#8211; Why Industrialization is Now the Industry\u2019s Biggest Challenge.<\/span><\/td>\n<td>ficonTEC<\/td>\n<\/tr>\n<tr>\n<td>9:35-10:35<\/td>\n<td><span style=\"color: #841585;\">How are You Helping Customers Move From Prototype to Production?<\/span><\/td>\n<td>Femtum, HTSI, BizLink, USI<\/td>\n<\/tr>\n<tr>\n<td>10:35-10:55<\/td>\n<td>Coffee Break<\/td>\n<td><\/td>\n<\/tr>\n<tr>\n<td>10:55-12:00<\/td>\n<td><span style=\"color: #841585;\">What are The Next Bottlenecks in Photonic Manufacturing?<\/span><\/td>\n<td>Femtum, HTSI, BizLink, USI<\/td>\n<\/tr>\n<tr>\n<td>12:00-12:45<\/td>\n<td>Lunch<\/td>\n<td><\/td>\n<\/tr>\n<tr>\n<td>12:45-13:45<\/td>\n<td><span style=\"color: #841585;\">How Can We Reduce Time to Market?<\/span><\/td>\n<td>Femtum, HTSI, BizLink, USI<\/td>\n<\/tr>\n<tr>\n<td>13:45-14:10<\/td>\n<td><span style=\"color: #841585;\">The Intelligent Automation Platform Connecting the Photonics Ecosystem<strong><br \/>\n<\/strong><\/span><\/td>\n<td>ficonTEC<\/td>\n<\/tr>\n<tr>\n<td>14:10-14:30<\/td>\n<td>Coffee Break<\/td>\n<td><\/td>\n<\/tr>\n<tr>\n<td>14:30-14:45<\/td>\n<td><span style=\"color: #841585;\">Taiwan Semiconductor Market Ecosystem<\/span><\/td>\n<td>Digitimes<\/td>\n<\/tr>\n<tr>\n<td>14:45-15:30<\/td>\n<td><span style=\"color: #841585;\">Panel Discussion: What Will It Take to Scale Photonics?<\/span><\/td>\n<td>All<\/td>\n<\/tr>\n<tr>\n<td>15:30-15:50<\/td>\n<td>Wrap-Up &amp; Conclusion<\/td>\n<td>ficonTEC<\/td>\n<\/tr>\n<tr>\n<td>15:50-17:00<\/td>\n<td>Social Gathering<\/td>\n<td>All<\/td>\n<\/tr>\n<\/tbody><\/table>\n<p>&nbsp;<\/p>\n<p>Note:<br \/>\nThe event will be conducted in English and Mandarin.<br \/>\nPlease be aware that photos and video footage will be taken during the seminar<\/p>\n[\/spb_text_block] [\/spb_accordion_tab] [spb_accordion_tab title=&#8221;SPEAKERS&#8221; accordion_id=&#8221;&#8221; icon=&#8221;&#8221;] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18808\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/andre-2-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/andre-2-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/andre-2-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/andre-2-768x768.jpg 768w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/andre-2-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/andre-2-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/andre-2.jpg 1000w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><\/p>\n<h3 class=\"ui-sortable-handle\">Andr\u00e9 Lalonde<br \/>\n<span data-teams=\"true\">President ficonTEST<\/span><\/h3>\n<p>Andr\u00e9 Lalonde is a photonics manufacturing and test executive with 25+ years of experience scaling advanced optical technologies from engineering development to high-volume production. His expertise spans wafer-level, chip-level, and module-level test for VCSELs, laser diodes, silicon photonics, and high-performance optical components. He has led the development of automated photonics test platforms and managed global manufacturing ramps and production transfers across Asia and North America, aligning engineering, operations, and supply chains for high-yield, high-throughput deployment.<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18687\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/eric-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/eric-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/eric-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/eric-768x768.jpg 768w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/eric-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/eric-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/eric.jpg 1000w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><\/p>\n<h3 class=\"ui-sortable-handle\">Eric Hsu<br \/>\nVice President at HTSI<\/h3>\n<p>Eric Hsu is a Vice President at Hermes Testing Solutions Inc. with 25 years of Wafer Prober &amp; Probing experience, specializing in Testing Solution Development with more than 20 patents in wafer testing field. At HTSI, his work focuses on Marketing Strategy &amp; Engineering Service Business . Eric received Outstanding Manager Award in 2022 and National Industrial Innovation Award in 2025.<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18714\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/profiles-seminar-louis-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/profiles-seminar-louis-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/profiles-seminar-louis-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/profiles-seminar-louis-768x768.jpg 768w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/profiles-seminar-louis-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/profiles-seminar-louis-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/profiles-seminar-louis.jpg 1000w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><\/p>\n<h3 class=\"ui-sortable-handle\">Louis-Rafa\u00ebl Robichaud<br \/>\nCEO &amp; Co-Founder of FEMTUM<\/h3>\n<p>Louis-Rafael Robichaud is the CEO of Femtum, where he leads the company\u2019s vision to advance precision laser solutions for next-generation manufacturing and photonics applications. With a strong background in engineering and deep expertise in laser technologies, he brings a combination of technical insight and strategic leadership to the organization. Louis-Rafael is passionate about bridging innovation and commercialization, building strong industry partnerships, and positioning Femtum at the forefront of scalable, high-impact technology solutions.<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18726\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/nick-shen-1-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/nick-shen-1-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/nick-shen-1-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/nick-shen-1-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/nick-shen-1-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/nick-shen-1.jpg 722w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><\/p>\n<h3 class=\"ui-sortable-handle\"><span data-teams=\"true\">Nick Shen<\/span><br \/>\nAVP of USI<\/h3>\n<p>Dr. Li-Cheng Shen received his B.S., M.S., and Ph.D. in Electrical and Control Engineering from National Yang Ming Chiao Tung University (NYCU), Taiwan, in 1992, 1994, and 1998, respectively. Majors in school included control system design, expert system, intelligent automation, system fault diagnosis, and multivariable analysis. He is currently the AVP of Miniaturization Competence Center (MCC)\/USI, focusing on researching and developing cutting-edge technologies of module &amp; system miniaturization. Application fields cover smartphone, WWAN, wearable, automotive, high performance computing, power module, SiPh, and consu-medical.<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18684\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/stefano-concezzi-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/stefano-concezzi-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/stefano-concezzi-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/stefano-concezzi-768x768.jpg 768w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/stefano-concezzi-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/stefano-concezzi-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/stefano-concezzi.jpg 1000w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><\/p>\n<h3 class=\"ui-sortable-handle\">Stefano Concezzi<br \/>\nCMO &amp; President of ficonTEC USA<\/h3>\n<p>Stefano has a PhD in Physics from the University of Parma, Italy. After various regional and international managerial roles in Sales &amp; Marketing within Italy in his early career, starting around 2002 Stefano was elevated to directorship roles within Sales &amp; Marketing at NI, based in Austin, TX\/USA. From there he progressed to Director \u2013 Science &amp; Big Physics, where he was responsible in particular for profitably developing their offering and support for key international scientific R&amp;D and so-called Big Physics (USDoE, CERN, ESRF, ITER, ELI and others).<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18681\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/Tzu-Fang-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/Tzu-Fang-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/Tzu-Fang-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/Tzu-Fang-768x768.jpg 768w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/Tzu-Fang-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/Tzu-Fang-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/Tzu-Fang.jpg 1000w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><\/p>\n<h3 class=\"ui-sortable-handle\">TzuFang Tseng<br \/>\nDirector of Research and Development of BizLink Group<\/h3>\n<p>Dr. TzuFang Tseng holds a Ph.D. from the Graduate Institute of Photonics and Optoelectronics at National Taiwan University. With over a decade of experience in optics and electromagnetic wave research, she currently serves as Director of Research and Development at BizLink Group. She focuses on developing high-speed connectivity products and connection solutions for co-packaged optics (CPO). Her areas of expertise include high-density fiber-array design for CPO applications, electromagnetic wave simulation, and signal integrity analysis for cable products.<\/p>\n<p>&nbsp;<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18798\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ying-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ying-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ying-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ying-768x768.jpg 768w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ying-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ying-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/ying.jpg 1000w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><\/p>\n<h3 class=\"ui-sortable-handle\">Ying Chen<br \/>\nDirector of Product Management &#8211; Photonics Assembly<\/h3>\n<p>Ying Chen has been with ficonTEC since 2015, currently serving as Sales Manager for the Asia Pacific region and overseeing indirect sales. In this role, he is responsible for delivering technical assembly and testing solutions to photonics customers, while also managing sales activities across key markets, including Israel, Taiwan, Singapore, and Korea. Prior to his current role, Ying served as Project Manager, successfully leading over 200 different projects. He also worked as a Product Manager, focusing on transceiver assembly solutions and high-power laser module assembly and testing solutions. Ying holds a degree in Microsystem Technology from the Technical University of Chemnitz in Germany.<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<h3 class=\"ui-sortable-handle\">Kiwi Hsu<img loading=\"lazy\" decoding=\"async\" class=\"alignleft wp-image-18763\" src=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/kiwi-300x300.jpg\" alt=\"\" width=\"250\" height=\"250\" srcset=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/kiwi-300x300.jpg 300w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/kiwi-150x150.jpg 150w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/kiwi-768x768.jpg 768w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/kiwi-600x600.jpg 600w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/kiwi-250x250.jpg 250w, https:\/\/www.ficontec.com\/wp-content\/uploads\/2026\/07\/kiwi.jpg 1000w\" sizes=\"auto, (max-width: 250px) 100vw, 250px\" \/><br \/>\nPanel Discussion Moderator of Digitimes Asia<\/h3>\n<p>Kiwi is a veteran industry analyst with 5 years of extensive experience specializing in industrial cluster and macroeconomic analysis across the Greater China and ASEAN markets. He possesses deep expertise across key technology sectors, including optical modules, Silicon Photonics, networking equipment, LEO satellites, semiconductors, data centers, and smart manufacturing.<\/p>\n[\/spb_text_block] [\/spb_accordion_tab] [\/spb_accordion] [spb_row wrap_type=&#8221;content-width&#8221; row_bg_type=&#8221;color&#8221; color_row_height=&#8221;content-height&#8221; bg_type=&#8221;cover&#8221; parallax_image_height=&#8221;content-height&#8221; parallax_image_movement=&#8221;fixed&#8221; parallax_image_speed=&#8221;0.5&#8243; parallax_video_height=&#8221;window-height&#8221; parallax_video_overlay=&#8221;none&#8221; row_overlay_opacity=&#8221;0&#8243; row_padding_vertical=&#8221;0&#8243; row_padding_horizontal=&#8221;0&#8243; row_margin_vertical=&#8221;30&#8243; remove_element_spacing=&#8221;no&#8221; inner_column_height=&#8221;col-natural&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;] [spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;1\/1&#8243; el_position=&#8221;first last&#8221;]\n<h3 style=\"text-align: center;\"><span style=\"color: #841585;\">Speakers Companies<\/span><\/h3>\n[\/spb_text_block] [spb_single_image image=&#8221;18639&#8243; image_size=&#8221;full&#8221; frame=&#8221;noframe&#8221; intro_animation=&#8221;none&#8221; full_width=&#8221;no&#8221; lightbox=&#8221;no&#8221; image_link=&#8221;https:\/\/femtum.com\/&#8221; link_target=&#8221;_blank&#8221; width=&#8221;1\/3&#8243; el_position=&#8221;first&#8221;] [spb_single_image image=&#8221;18636&#8243; image_size=&#8221;full&#8221; frame=&#8221;noframe&#8221; intro_animation=&#8221;none&#8221; full_width=&#8221;no&#8221; lightbox=&#8221;no&#8221; image_link=&#8221;https:\/\/www.bizlinktech.com\/&#8221; link_target=&#8221;_blank&#8221; width=&#8221;1\/3&#8243;] [spb_single_image image=&#8221;18757&#8243; image_size=&#8221;full&#8221; frame=&#8221;noframe&#8221; intro_animation=&#8221;none&#8221; full_width=&#8221;no&#8221; lightbox=&#8221;no&#8221; image_link=&#8221;https:\/\/www.usiglobal.com\/en&#8221; link_target=&#8221;_blank&#8221; width=&#8221;1\/3&#8243; el_position=&#8221;last&#8221;] [\/spb_row]\n","protected":false},"excerpt":{"rendered":"<p>[spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;3\/4&#8243; el_position=&#8221;first last&#8221;] Thank you very much for participating A big thank you to everyone who visited the ficonTEC Expert Seminar ASIA. Here is a brief summary of this year&#8217;s event at Semicon in Taiwan. We look forward to welcoming you again next year as a guest or speaker. Once again, many thanks to all participants. [\/spb_text_block] [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":18572,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[343],"tags":[],"class_list":["post-18478","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-seminars"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.6 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Seminar - Asia - ficonTEC<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ficontec.com\/seminar-asia\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Seminar - Asia - ficonTEC\" \/>\n<meta property=\"og:description\" content=\"[spb_text_block pb_margin_bottom=&#8221;no&#8221; pb_border_bottom=&#8221;no&#8221; width=&#8221;3\/4&#8243; el_position=&#8221;first last&#8221;] Thank you very much for participating A big thank you to everyone who visited the ficonTEC Expert Seminar ASIA. 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