{"id":19080,"date":"2026-10-01T08:56:05","date_gmt":"2026-10-01T06:56:05","guid":{"rendered":"https:\/\/www.ficontec.com\/?p=19080"},"modified":"2026-10-01T09:10:25","modified_gmt":"2026-10-01T07:10:25","slug":"ficontec-and-htsi-announce-strategic-cooperation-to-scale-advanced-cpo-test-solutions-in-taiwan","status":"publish","type":"post","link":"https:\/\/www.ficontec.com\/jp\/ficontec-and-htsi-announce-strategic-cooperation-to-scale-advanced-cpo-test-solutions-in-taiwan\/","title":{"rendered":"ficonTEC and HTSI Announce Strategic Cooperation to Scale Advanced CPO Test Solutions in Taiwan"},"content":{"rendered":"[spb_row wrap_type=”content-width” row_bg_type=”image” color_row_height=”content-height” bg_type=”cover” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ row_padding_vertical=”30″ row_padding_horizontal=”0″ row_margin_vertical=”0″ remove_element_spacing=”no” inner_column_height=”col-natural” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

October 2026<\/span><\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

Business News<\/span><\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

ficonTEC & HTSI Announce Strategic Cooperation to Scale Advanced CPO Test Solutions in Taiwan<\/h1>\n[\/spb_text_block] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

Partnership combines ficonTEC\u2019s double-sided electro-optical wafer-level test technology and CPO manufacturing expertise with HTSI\u2019s established semiconductor manufacturing, engineering and service capabilities in Taiwan.<\/h3>\n

Achim and Hsinchu \u2014 [October 1st]<\/strong> \u2014 ficonTEC Service GmbH (\u201cficonTEC\u201d), a global provider of automated photonic assembly and test solutions, and Hermes Testing Solutions Inc. (\u201cHTSI\u201d), a Taiwan-based provider of semiconductor testing solutions, today announced a strategic cooperation to support the rapidly expanding co-packaged optics (CPO) ecosystem in Taiwan.<\/p>\n

\"\"<\/h3>\n

The initial focus of the cooperation will be the industrialization and scalable deployment of ficonTEC\u2019s double-sided electro-optical wafer-level test platform, referred to within the CPO insertion flow as INS-2, for advanced silicon photonics wafer testing.
\nThe cooperation is designed to combine ficonTEC\u2019s experience in silicon photonics and CPO test automation with HTSI\u2019s established semiconductor equipment manufacturing, engineering and local service capabilities. Together, the companies intend to provide customers in Taiwan with localized equipment delivery, responsive local engineering support and a scalable manufacturing path as demand for CPO test capacity increases.<\/p>\n

Scaling Double-Sided Wafer-Level Test for CPO<\/strong>
\nCPO architectures introduce new manufacturing and test challenges by combining photonic and electronic functionality within increasingly complex three-dimensional structures. These architectures require simultaneous access to electrical and optical interfaces during wafer-level test.<\/p>\n

ficonTEC\u2019s INS-2 platform addresses this challenge through a 300 mm double-sided electro-optical wafer-level test architecture that enables electrical probing from the top of the wafer while providing precision optical access from below.
\nThe system architecture includes a customized slotted wafer chuck, precision wafer positioning, a six-axis optical alignment engine, automated wafer handling, vision, probe inspection and cleaning capabilities designed to support high-throughput manufacturing environments.<\/p>\n

Importantly, the platform is ATE-agnostic and designed to integrate with industry-standard semiconductor automated test equipment, allowing customers to deploy the optical test capability within their existing ATE infrastructure rather than creating a closed test architecture. The companies expect this flexibility to be particularly important as CPO technologies move from development toward qualification, ramp and high-volume manufacturing.<\/p>\n

From Equipment Delivery to Continuous Manufacturing Improvement<\/strong>
\nThe cooperation between ficonTEC and HTSI is intended to extend beyond equipment manufacturing and delivery.
\nThe companies plan to establish a collaborative engineering framework supporting rapid design reviews, local system integration, installation, qualification, service and continuous improvement of the INS-2 platform.<\/p>\n

<\/a>This joint engineering approach will support the evaluation and optimization of key manufacturing metrics as CPO moves into volume production, including units per hour (UPH), equipment availability, process stability.<\/p>\n

Customer and application feedback will be incorporated into ongoing platform development, helping both companies accelerate design reviews and continuously improve system performance while maintaining the quality and repeatability required for semiconductor manufacturing.<\/p>\n

Combining Global CPO Experience with Taiwan Semiconductor Expertise<\/strong>
\nficonTEC has accumulated significant practical experience in electro-optical wafer-level testing for advanced silicon photonics and CPO applications, including development work involving leading global ATE platforms and advanced CPO manufacturing environments.<\/p>\n

This experience complements HTSI\u2019s more than 20 years of semiconductor testing expertise and its established capabilities in equipment manufacturing, installation, technical support, manufacturingprocess development, customization and responsive local engineering service.<\/p>\n

By bringing these capabilities together, ficonTEC and HTSI aim to provide customers with more than an individual piece of equipment: a locally supported manufacturing solution capable of evolving alongside rapidly changing CPO architectures and production requirements.<\/p>\n

\u201cThe transition of CPO from technology development to industrial manufacturing requires more than innovative devices\u2014it requires manufacturing capacity,\u201d said Stefano Concezzi, CMO and Corporate Vice President of ficonTEC Service GmbH. \u201cOur goal with HTSI is to combine the CPO test experience we have developed with Taiwan\u2019s exceptional semiconductor manufacturing ecosystem. Together, we can shorten delivery times, provide strong local engineering and service, and continuously improve the productivity and yield of the platform as customers move toward volume production.\u201d\"\"<\/p>\n

\u201cTaiwan plays a critical role in the global semiconductor and AI supply chain, and CPO represents an important new opportunity for advanced semiconductor testing,\u201d said Steven Wang, President of Hermes Testing Solutions Inc. \u201cBy combining ficonTEC\u2019s specialized photonics test technology with HTSI\u2019s manufacturing, engineering and customer-service capabilities, we intend to provide customers with a highly responsive local solution from system deployment through production support and continuous improvement.\u201d<\/p>\n

Building the CPO Manufacturing Ecosystem<\/strong>
\nThe cooperation is part of ficonTEC\u2019s broader effort with Taiwan and North American semiconductor, photonics, test and manufacturing companies to accelerate the industrialization of silicon photonics.<\/p>\n

The rapid expansion of AI infrastructure is creating growing requirements for optical connectivity and, consequently, for scalable photonic assembly and test capacity. ficonTEC and HTSI believe that meeting this demand will require an ecosystem approach connecting device designers, foundries, OSATs, ATE suppliers, equipment manufacturers and local engineering organizations. The initial INS-2 cooperation establishes a foundation that the companies expect can expand as CPO manufacturing requirements evolve.<\/p>\n

The future is powered by photonics. We automate it.<\/strong><\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

To learn more about <\/strong>ficonTEC & HTSI Strategic Cooperation contact us directly or follow us on LinkedIN<\/a>.
\n<\/strong><\/p>\n<\/i>Contact us<\/span><\/a>\n

 <\/p>\n

\u00a0<\/strong><\/p>\n[\/spb_text_block] [\/spb_row] [spb_column width=”1\/2″ el_position=”first”] [spb_single_image image=”17254″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” link_target=”_self” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

About ficonTEC<\/h3>\n

ficonTEC Service GmbH develops and manufactures automated production systems for photonic and optoelectronic devices, supporting customers from product development and process engineering through high-volume manufacturing. Its solutions cover precision assembly, active alignment, fiber attachment and electro-optical test for applications including silicon photonics, co-packaged optics, communications, sensing and other advanced photonic systems.
\nWith operations and customer support across Europe, North America and Asia, ficonTEC works with semiconductor, photonics and technology companies to industrialize photonic manufacturing and move production from lab to fab.<\/p>\n

For more information, visit www.ficontec.com<\/a>.<\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/2″ el_position=”last”] [spb_single_image image=”19133″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” link_target=”_self” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

About Hermes Testing Solutions Inc.<\/h3>\n

Hermes Testing Solutions Inc. (HTSI) was founded in 2004 and has grown alongside the semiconductor testing industry. Over the past 20 years, we have accumulated a wealth of technical capabilities to provide customers with comprehensive value-added semiconductor testing services, including sales, installation, technical support, manufacturing process development, machine relocation, and design customization. With presence in Taiwan, China, Japan, United States, Singapore, and Malaysia, HTSI offers a wide range of services to meet the needs of its customers.<\/p>\n

For more information, visit www.hermes-testing.com.tw<\/a>.<\/p>\n[\/spb_text_block] [\/spb_column]<\/p>\n","protected":false},"excerpt":{"rendered":"

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