Oktober 2025
Product News
ficonTEC launches DLT-D1 , a multi-site die-level tester for double-sided compact 3D CPO optical engines
DLT-D1 die-level tester with three parallel test stations
Achim, Germany, September 2025 – ficonTEC has announced the launch of the DLT-D1, a next-generation high-throughput, multi-site parallel test handler designed specifically for double-sided compact optical engines. The DLT-D1 extends ficonTEC’s industry-leading Co-Packaged Optics (CPO) test ecosystem, addressing the growing demand for 2.5D and 3D CPO architectures in high-performance computing (HPC) and data switching applications.
The system supports everything from DC parametric measurements to full data-rate RF testing, combining active optical alignment from the bottom-side of the device under test (DUT) with high-frequency electrical probing from the top-side. For DUTs with receptacles attached, the DLT-D1 can alternatively provide automated fiber coupling. A fully automated JEDEC magazine tray loader streamlines device handling, making the platform ideally suited for OSATs and other high-volume production environments.
Engineered for maximum productivity, the DLT-D1 can operate with up to three parallel test heads connected to either automated test equipment (ATE) or dedicated instrumentation. This scalable configuration significantly reduces test cost while maintaining high repeatability, helping customers accelerate time-to-market.
With the addition of the DLT-D1 to its previously announced double-sided wafer-level tester (WLT-D2) and single-sided wafer-level tester (WLT-S2), ficonTEC now delivers the industry’s most comprehensive test portfolio – from wafer to die-level – all built on a unified software interface and common test data framework.
To learn more about our latest silicon photonics testing solutions, visit the ficonTEC booth at ECOC 2025 (#C2221), contact us directly or follow us on LinkedIN.
About ficonTEC
ficonTEC is the recognized market leader in automated assembly and testing systems for integrated photonic devices and high-end opto-electronic components. With over 25 years of expertise, ficonTEC has developed advanced photonics process and manufacturing capabilities tailored to diverse high-tech industry segments.
More recently, ficonTEC’s flexible and scalable Industry 4.0 automation options are enabling new approaches to development and manufacturing, in particular for CPO-enabled optics destined for AI-driven data center applications. By actively supporting the CPO production workflow and other cutting-edge photonics manufacturing trends, ficonTEC continues to drive innovation in manufacturing, delivering class-leading solutions that meet the dynamic needs of modern industries.
For more information, visit www.ficontec.cn.
