Step 2/6 - Primary assembly/test function

Choose primary (select 1 – use 'Secondary' & 'Additional Notes' to add detail)micro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microwelding

Step 3/6 - Secondary assembly/test function (if any)

Choose secondarymicro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microweldingnot specifiednone

Step 4/6 - Target application space

Choose targetsensors/lidarcommunicationsquantum technologyhealthcareimage captureaerospace/spaceprintmacro/industrialmixed/variousnot specifiednone

Step 5/6 - Product development workflow?

Choose workflowR&Dprototypingproduct developmentprocess developmentbatch manufacturinghigh-volume, in-linenot specifiednone

Step 6/6 - Target deadline for installation?

Choose deadlineQ1/2025Q2/2025Q3/2025Q4/2025Q1/2026not specifiednone

Additional notes